银行科创债发行突破2000亿元

Core Viewpoint - The bond market's "Technology Board" has seen significant growth in the issuance of technology innovation bonds (referred to as "Sci-Tech Bonds") since its launch on May 7, with a total issuance exceeding 388.3 billion yuan by June 5 [1] Group 1: Issuance Scale - From May 7 to June 5, a total of 202 Sci-Tech Bonds were issued, with an issuance scale surpassing 388.3 billion yuan [1] - An additional 6 Sci-Tech Bonds are set to be issued from June 6 to June 10 [1] Group 2: Issuing Entities - Financial institutions, private equity investment institutions, and venture capital institutions are actively participating in the issuance of Sci-Tech Bonds [1] - Among the issued bonds, 16 banks were the main issuers, contributing to 20 bonds with a total issuance of 201 billion yuan, accounting for over half of the total issuance [1] - Non-bank financial institutions, including securities companies and equity investment institutions, collectively issued bonds totaling 32.4 billion yuan [1]