胜蓝股份不超4.5亿可转债获深交所通过 东莞证券建功

Core Viewpoint - The Shenzhen Stock Exchange's listing review committee has approved Shenglan Technology Co., Ltd.'s plan to issue convertible bonds, indicating compliance with issuance, listing, and information disclosure requirements [1] Group 1: Convertible Bond Issuance - Shenglan Technology plans to raise a total of up to RMB 450 million through the issuance of convertible bonds, which will be used for the research and development of high-voltage connectors and components for new energy vehicles, as well as industrial control connectors [1] - The convertible bonds will be issued to unspecified investors, including natural persons, legal entities, and qualified institutional investors, with a face value of RMB 100 per bond [2] - The interest rate for the bonds will be determined by the company's board of directors in consultation with the lead underwriter, based on national policies, market conditions, and the company's specific situation [2] Group 2: Underwriting and Management - Dongguan Securities Co., Ltd. is the lead underwriter for this issuance, with representatives Zhu Zeliang and Yang Guohui overseeing the process [2]