erent (COHR) Globenewswire·2025-06-12 20:35Core Insights - Coherent Corp. has launched a diamond-loaded silicon carbide (SiC) ceramic composite aimed at improving thermal management in advanced AI datacenters and high-performance computing (HPC) systems [1][4] Product Features - The new diamond-silicon carbide material achieves isotropic thermal conductivity exceeding 800 W/m-K, which is twice the performance of copper, the current industry standard [2] - The composite closely matches the coefficient of thermal expansion (CTE) of silicon, making it suitable for direct integration with semiconductor devices [2] Performance Benefits - The diamond-SiC material significantly enhances reliability, extends component lifetimes, and reduces cooling costs, which can account for up to 50% of a datacenter's energy consumption [3] - The composite is designed to be corrosion-resistant, electrically insulating, and mechanically robust across a wide temperature range, making it compatible with direct liquid cooling (DLC) systems [3] Applications - Key applications for this innovation include direct to chip heat spreading, microchannel cold plates, semiconductor device substrates, and other advanced solutions where traditional copper-based materials are inadequate [3]