我国科研人员“以柔克刚”填补微型LED晶圆无损测试技术空白

Core Viewpoint - Micro LED technology is identified as the core component of next-generation high-end display technology, with a critical need for 100% yield in wafer production to avoid significant repair costs for end products. Recent advancements in non-destructive testing methods have addressed this technological gap [1][7]. Group 1: Technological Breakthrough - Researchers from Tianjin University have developed a high-throughput non-destructive testing method for micro LED wafers, marking a significant breakthrough in the field [1][7]. - The new detection method utilizes a flexible electronic technology-based probe array that adapts to the surface morphology of the wafer, applying a minimal contact pressure of 0.9 MPa, which is one ten-thousandth of that used by traditional rigid probes [3][4]. Group 2: Impact on Industry - The innovative testing system, which works in conjunction with the flexible probes, provides essential tools for efficient process control and quality screening of micro LED products [4][6]. - This technology is expected to facilitate mass production, non-destructive testing, and cost-effective solutions for the domestic micro LED industry, thereby expanding the application of flexible electronic technology [7].