

Group 1 - The core point of the announcement is that BOE Technology Group Co., Ltd. has successfully issued a bond with a total scale of up to RMB 20 billion, approved by the China Securities Regulatory Commission [1] - The bond issuance took place from June 12 to June 13, 2025, with a subscription multiple of 4.42 times, indicating strong investor interest [1] - Major underwriters, including CITIC Securities and Guolian Minsheng Securities, participated in the subscription, with CITIC Securities subscribing for RMB 300 million and Guolian Minsheng Securities for RMB 100 million [1] Group 2 - The bond is categorized as a technology innovation corporate bond aimed at professional investors, complying with relevant regulations and guidelines [1] - The issuance price of the bond is set at RMB 100 per bond, and it is designed to attract institutional investors through a private placement method [1] - There are no significant shareholders or related parties participating in the bond subscription, ensuring compliance with regulatory requirements [1]