Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

Core Insights - Synopsys and Samsung Foundry are collaborating to enhance designs for advanced edge AI, HPC, and AI applications, enabling successful tape-outs with improved power, performance, and area (PPA) [2][3] - The partnership focuses on optimizing semiconductor technologies for complex computational tasks, particularly in the context of sub-2nm process technologies [3][4] - Synopsys' AI-driven design flows and certified EDA tools are integral to this collaboration, facilitating efficient integration and reduced turnaround times for mutual customers [5][6] Collaboration Highlights - The recent successful tape-out involved Synopsys' 3DIC Compiler and Samsung's I-CubeS 2.5D packaging technology, significantly reducing HBM routing time to 4 hours and improving performance metrics [4][6] - The collaboration has achieved a 10X reduction in turnaround time for customer designs using the HBM3 design on the SF2 process [6] - Synopsys' AI-driven digital and analog flows have been certified for Samsung's SF2P process, enhancing the efficiency of standard cell space usage [6][8] Portfolio and Market Impact - Synopsys offers a comprehensive portfolio of high-quality IP optimized for various applications, including high-performance computing, consumer electronics, and automotive markets [8] - The collaboration supports a wide range of advanced process nodes, from 14LPP/U to the latest SF4X and SF2P/A, enabling faster time-to-market for next-generation designs [8] - New Synopsys IP, including 224G, UCIe, MIPI, and LPDDR6, is designed to provide a low-risk path to silicon success for customers [6][8]