广州黄埔：鼓励发展高端半导体和传感器材料 打造中国集成电路产业第三极核心承载区

Core Viewpoint - The issuance of the "Several Policy Measures to Support the High-Quality Development of the Integrated Circuit Industry in Huangpu District, Guangzhou Development Zone" aims to establish a core area for China's integrated circuit industry, focusing on optimizing industrial layout and promoting breakthroughs in various sectors of the industry [1] Group 1: Industrial Development - The policy emphasizes optimizing the industrial development layout, achieving breakthroughs in chip design, specialty processes, advanced packaging and testing, EDA tools, equipment, and components [1] - The goal is to create a comprehensive integrated circuit industry cluster that encompasses design, manufacturing, materials, equipment and components, as well as packaging and testing [1] Group 2: Material and Equipment Development - The initiative encourages the development of high-end semiconductor and sensor manufacturing materials, including photomasks, electronic gases, photoresists, polishing materials, and high-purity targets [1] - There is a focus on continuously conducting R&D and technological breakthroughs around key components and system integration in integrated circuit manufacturing [1] Group 3: Investment and Funding - The policy aims to improve the investment and financing environment, seeking support from national, provincial, and municipal integrated circuit funds [1] - It highlights the importance of leveraging fund platforms such as the district's technology innovation and entrepreneurship investment mother fund to enhance cooperation with integrated circuit enterprises [1]