Zhong Guo Xin Wen Wang·2025-06-17 09:10Group 1 - Recently, two securities firms, Huatai Securities and CITIC Construction Investment Securities, announced approval to issue technology innovation bonds, with Huatai Securities set to issue bonds totaling up to 10 billion yuan and CITIC Construction Investment Securities up to 6 billion yuan [1][3] - On June 13, three other firms, CITIC Securities, CICC, and Guotai Junan Securities, collectively received approval to issue technology innovation bonds, with a total approved amount nearing 40 billion yuan [3] - The issuance of technology innovation bonds is now expanding into the interbank bond market, which was previously dominated by exchange markets, indicating a broader scope for future issuances [3] Group 2 - In 2024, a total of 60 securities firms acted as main underwriters for technology innovation bonds, underwriting 539 bonds, which represents a year-on-year increase of 61.38%, with a total underwriting amount of 613.686 billion yuan, up 68.48% year-on-year [3][4] - Recent policies supporting the issuance of technology innovation bonds have significantly boosted issuance activity, with May 2023 seeing a record issuance scale of 363.8 billion yuan, a 123% increase month-on-month [4] - The introduction of the "Technology Innovation Bond 2.0" era aims to expand the range of issuers and improve support mechanisms, enhancing financing accessibility for private enterprises and those with weaker credit ratings [4]