壮大科创“耐心资本” 深圳首单民营创投机构 科创债成功落地

Core Viewpoint - The successful issuance of the first private venture capital institution's technology innovation bond in Shenzhen marks a new financing model for supporting technology innovation enterprises, significantly enhancing their financing capabilities and providing stable funding for long-term development [1][2][6]. Group 1: Bond Issuance Details - The total registered scale of the Oriental Fuhai technology innovation bond project is 1.5 billion RMB, with the first phase raising 400 million RMB and a bond term of 10 years (5+3+2), which is the largest in its batch [2]. - The funds raised will be specifically used for venture capital fund contributions and replacements, focusing on strategic emerging industries such as artificial intelligence, digital economy, new energy, new materials, semiconductors, and biomedicine [2][3]. Group 2: Support Mechanisms - The project is backed by a full guarantee from China Bond Credit Enhancement Investment Co., Ltd. and a counter-guarantee from Shenzhen High-tech Investment and Financing Guarantee Co., Ltd., significantly reducing the bond issuance cost for private venture capital institutions [3][4]. - The innovative "central-local dual insurance" risk-sharing mechanism has been established, which lowers financing costs and alleviates the financing difficulties faced by private venture capital institutions [3][6]. Group 3: Market Impact and Future Prospects - The project has attracted enthusiastic subscriptions from investors, with a subscription rate of 6.3 times and an issuance interest rate of 1.85%, indicating strong market confidence [2][3]. - The successful launch of this bond is expected to create a positive demonstration effect, guiding more bond funds to transform into "patient capital" and support early-stage, hard technology projects, thus forming a virtuous cycle of fundraising, investment, management, and exit [2][6]. Group 4: Policy and Strategic Alignment - The project aligns with recent policy directives from the central government aimed at deepening reform and innovation in Shenzhen, which includes optimizing the financing mechanisms for technology enterprises [5][6]. - The bond issuance exemplifies the integration of policy guidance and market mechanisms, providing a replicable model for financial support of technology innovation across the country [6].