智通财经网·2025-06-19 00:44Core Insights - The rise of artificial intelligence (AI) presents new development opportunities for Co-Packaged Optics (CPO) technology and related companies [1][2] - CPO technology integrates optical devices with silicon chips on the same packaging substrate, addressing challenges in bandwidth, power consumption, and cost for the next generation [1] - Analysts predict a significant market growth for CPO starting in 2027, with the market size expected to exceed $1 billion in 2028 and surpass $5 billion by 2030 [2] Industry Analysis - CPO offers clear advantages over traditional interconnect methods, particularly in performance and power consumption, as traditional technologies approach physical limits [2] - Despite challenges such as thermal management, reliability, and maintainability, ongoing advancements in these areas and concerns over traditional solutions are driving the industry towards CPO [2] - The adoption rate of CPO may accelerate faster than initially expected, with increasing investments from suppliers [2] Key Companies - Companies likely to benefit from CPO include: Broadcom (AVGO.US), Coherent (COHR.US), Corning (GLW.US), Fabrinet (FN.US), Lumentum (LITE.US), Marvell Technology (MRVL.US), NVIDIA (NVDA.US), TSMC (TSM.US), UMC (UMC.US), Cisco (CSCO.US), and Advantest (ATEYY.US) [3]