统联精密: 关于子公司以知识产权质押等方式向金融机构申请授信的公告

Group 1 - The company’s subsidiaries are applying for a total credit limit of up to RMB 35 million to broaden financing channels and reduce financing costs [1][2] - The subsidiary Shenzhen Panhai Tonglian Precision Mould Co., Ltd. is pledging a patent as collateral for a credit limit of RMB 20 million [1] - The company’s major shareholder and actual controller, Mr. Yang Hu, and his spouse, Ms. Wang Xiaolin, are providing counter-guarantees for the financing, which is considered a related party transaction but does not require additional review [2][3] Group 2 - The financing will be used for the daily operations of the subsidiaries and has a term of 360 days [1] - The company is eligible for subsidies of up to 70% of the actual comprehensive financing costs for loans obtained through intellectual property pledges, which will help reduce financial costs [3] - The application for credit is in line with the company’s development needs and will not adversely affect the company or its shareholders [3]