Core Insights - The company announced the launch of a new generation of chips supporting edge AI and multiple IoT wireless connectivity technologies by the end of 2024, with sales reaching tens of millions of RMB by Q2 2025 [1] - The rapid growth in customer demand for integrated edge AI capabilities and the diversification of AIoT products have led the company to strategically develop different series of chip product lines [1] - The TL721X series is recognized as an industry-leading low-power edge AI multi-protocol IoT wireless SoC chip, designed to meet the high standards of ultra-low power AI computing and various wireless connectivity for next-generation smart IoT terminal products [1] - The TL751X series offers high performance, multi-protocol support, and high integration, featuring advanced multi-core designs including CPU, NPU, and DSP, suitable for various smart wireless IoT and audio SoC applications [1] Product Certification and Development Support - The TL7 series chips are among the first in China to receive certification for the latest BLE 6.0 Bluetooth protocol [2] - The company provides a TL-EdgeAI development platform for developers, supporting mainstream edge AI models such as Google LiteRT, TVM, and PyTorch, allowing customers to integrate trained AI models into the chips within hours [2] - A certification module based on the TL721X will be launched soon to further assist customers in shortening development timelines and accelerating time-to-market [2]
泰凌微(688591.SH):近期将推出以TL721X为基础的认证模块