Zheng Quan Zhi Xing·2025-06-23 14:40Core Viewpoint - The company successfully completed the issuance of its third phase of technology innovation bonds, raising a total of RMB 2 billion, which will be used for working capital and repaying bank loans [2]. Group 1: Bond Issuance Details - The total amount raised from the third phase of technology innovation bonds is RMB 20 billion [2]. - RMB 10 billion of the funds will be used to supplement working capital for the company and its subsidiaries, while the other RMB 10 billion will be used to repay bank loans [2]. - The bonds were issued at a fixed annual interest rate of 2.00% [2]. - The bonds have a term of 3+N years and will remain outstanding until redeemed by the issuer [2]. - The bonds were issued at par value, with a face value of RMB 100 [2]. - The issuance was organized by a lead underwriter, China Merchants Bank, along with several co-underwriters [2]. Group 2: Regulatory and Credit Information - The bonds received a credit rating of AAA from China Chengxin International Credit Rating Co., Ltd., with a stable outlook [2]. - The bonds are not secured by any guarantees [2]. - The registration for the debt financing tools is valid for two years from the acceptance notice date [1].