宏微科技赵善麒：用硬核技术穿越产业周期

Core Viewpoint - The chairman of Hongwei Technology, Zhao Shanqi, emphasizes that maintaining the original intention is the key to overcoming challenges in the power semiconductor industry, which is currently undergoing significant adjustments [2]. Group 1: Market Position and Strategy - Hongwei Technology aims to capture the high-end market, which still has 90% of its potential untapped in China, despite short-term price wars causing pain [2]. - The company has established a solid technological moat through years of deep cultivation in core areas such as chip design, manufacturing, packaging, and testing of power semiconductors like IGBT and FRD [3]. - In 2024, Hongwei Technology plans to double the production volume of its automotive modules and has already achieved stable supply of photovoltaic modules to the market [4]. Group 2: Technological Advancements - The company has made significant breakthroughs in key technologies, including the completion of 12-inch wafer mass production processes in collaboration with partners like Huahong Hongli [3]. - Hongwei Technology is focusing on the development of third-generation semiconductor materials, particularly SiC and GaN, which are reshaping the power semiconductor landscape [5][6]. - The company has successfully validated its first 1200V 40mohm SiC MOSFET chip and is accelerating the verification and delivery of its SiC automotive modules [6]. Group 3: Market Expansion and Partnerships - Hongwei Technology is expanding its presence in emerging markets such as data centers and servers, having established long-term partnerships with several international clients [4]. - The company is also increasing its efforts to penetrate high-end overseas markets, including partnerships with companies like Hitachi Energy and Siemens [7]. - The dual strategy of technological positioning and deep market cultivation is seen as the core strategy for seizing opportunities in the industry's recovery [7].