银行间债券市场首单券商科创债发行

Core Viewpoint - CITIC Securities plans to issue its first technology innovation bonds in the interbank market, with a basic issuance scale of 500 million yuan and an additional 500 million yuan in excess issuance rights, aimed at supporting technology innovation businesses [1][2]. Group 1: Issuance Details - The bond has a term of 5 years, with the issuance date set for June 26, 2025 [1]. - The People's Bank of China approved CITIC Securities to issue up to 6 billion yuan in technology innovation bonds, valid from June 11, 2025, to June 10, 2027, allowing for flexible issuance timing [2]. - Other major brokerages, including Huatai Securities, have also received approval for technology innovation bonds, with Huatai allowed to issue up to 10 billion yuan [2][3]. Group 2: Market Context - A total of 5 major brokerages have been approved for a combined issuance quota of 55.8 billion yuan in the interbank market for technology innovation bonds, marking a significant expansion of financing channels for brokerages [3]. - Previously, technology innovation bonds were primarily issued in the exchange market, with CITIC Securities being the first to issue in the interbank market [3][4]. - The issuance of technology innovation bonds is part of a broader initiative by the People's Bank of China and the China Securities Regulatory Commission to support financing for technology innovation through various financial instruments [4].