日月光加码投资先进封装 CEO吴田玉：需求才刚开始

Core Viewpoint - Advanced packaging demand is just beginning, and the company will continue to invest heavily in this area, particularly in Southeast Asia, while strengthening production lines for automotive and robotics testing [1][2] Group 1: Company Strategy - The company plans to increase investments in advanced packaging and testing capabilities, with panel-level packaging set to begin small-scale production by the end of the year [2] - The CEO emphasized that the company will not hold back on investments, particularly in advanced packaging, until at least 2026 [1] Group 2: Market Outlook - The global semiconductor market is expected to reach $1 trillion in the next decade, driven primarily by AI as a key innovation force [1] - The company anticipates a 10% year-over-year increase in advanced packaging revenue this year, reflecting strong demand in the AI hardware sector [1] Group 3: Industry Trends - TSMC's CoPoS advanced packaging technology is seen as an upgrade to CoWoS, with the potential for outsourcing production to packaging partners as demand increases [2] - The company views the diversification strategies of offshore clients as both a challenge and an opportunity for the Taiwanese semiconductor industry [2]