“柔性触手+智能之眼”实现晶圆无损体检

Core Viewpoint - The research team from Tianjin University has developed a groundbreaking method for non-destructive testing of micro-LED wafers, addressing significant challenges in the production and quality assurance of next-generation display technologies [1][2]. Group 1: Technology Development - The team introduced a novel non-destructive testing method using a flexible probe system, which can adapt to the micro-scale variations of the wafer surface with a gentle pressure of only 0.9 MPa [2]. - This flexible probe system, composed of an elastic micro-pillar array and extendable electrodes, demonstrates remarkable durability, maintaining functionality after 1 million contacts, which is ten times longer than traditional rigid probes [2][3]. - The unique three-dimensional pressure-reducing structure of the probe ensures that internal stress remains safe and controllable even under extreme deformation [2]. Group 2: System Integration - An intelligent detection system was developed to complement the flexible probes, ensuring perfect alignment with the wafer and enabling real-time capture of LED activation states while measuring electrical parameters and contact pressure [2][3]. - The system includes a spherical leveling device that guarantees parallelism between the probe and the wafer, enhancing measurement accuracy [2]. Group 3: Industry Impact - The research has led to the creation of a high-density flexible probe array capable of handling ultra-small dimensions of 10×30 micrometers, paving the way for next-generation high-speed wafer testing [3]. - The technology addresses critical pain points in the LED industry and opens new pathways for complex wafer testing, with plans for industrialization to provide cost-effective testing solutions for the domestic LED sector [3]. - Additionally, this advancement lays the groundwork for improving yield rates in high-end display panels used in augmented reality (AR) and virtual reality (VR) applications [3].