智通财经网·2025-07-01 12:48Core Viewpoint - The "Silicon Photonics Revolution" led by major chip companies like Nvidia, TSMC, and Broadcom is expected to transform the AI computing industry, accelerating the adoption of Co-Packaged Optics (CPO) and Optical I/O technologies from experimental labs to global applications [1][5][19]. Industry Overview - The global optical communication data center interconnect market, including CPO and Optical I/O technologies, is projected to grow at a compound annual growth rate (CAGR) of over 80% from 2028 to 2033, reaching nearly $2.5 billion by 2033 [5][19]. - The demand for Optical I/O modules in large data centers is expected to be 2-7 times that of CPO modules by 2033, indicating a significant market expansion for Optical I/O [5][11]. Company Insights - Nvidia is integrating silicon photonics technology into its high-performance networking products, which is anticipated to enhance the scalability and efficiency of its AI GPU clusters, solidifying its leadership in the AI infrastructure market [20][21]. - TSMC is expected to lead in silicon photonics chip manufacturing, leveraging its advanced processes and packaging capabilities to attract major clients like Nvidia and AMD, thereby strengthening its dominant position in the high-performance computing and optical communication chip manufacturing sectors [21][24]. - Broadcom is developing its own CPO high-performance switching chip solutions and is expected to integrate silicon photonics interfaces into its next-generation switching platforms, which will significantly enhance its competitiveness in the cloud data center market [24][27].