★股债联动 引金融"活水"滋润科技创新

Group 1 - The core viewpoint emphasizes the need for financial support to drive technological innovation, with a focus on strengthening the linkage between equity and debt markets to facilitate funding for tech enterprises [1][4] - The issuance of technology innovation bonds (科创债) has rapidly progressed since the announcement by the People's Bank of China and the China Securities Regulatory Commission on May 7, with 223 issuers launching 300 bonds totaling 502.1 billion yuan by June 20 [2] - The characteristics of the technology innovation bond market include large issuance scale, high subscription enthusiasm, low interest rates, and diverse issuers, with banks being the primary issuers [2][3] Group 2 - The first batch of technology innovation bond ETFs has been submitted for approval, indicating a maturing market for these financial products, which are expected to attract long-term institutional investors [3][4] - The flexibility in the use of funds raised through technology innovation bonds is highlighted, addressing the financing needs of startups and growth-stage tech companies while promoting interaction between equity and bond markets [2][4] - Future developments are expected to include the expansion of eligible issuers for technology innovation bonds to include small and private enterprises, alongside the introduction of supportive mechanisms such as interest subsidies and guarantees [4]