Core Viewpoint - Huayu Electronics has submitted its IPO application to the Beijing Stock Exchange, following a previous attempt at the Shenzhen Stock Exchange that was withdrawn in September 2023 [1] Group 1: Company Overview - Established in October 2014, Huayu Electronics specializes in integrated circuit packaging and testing, with its main operations including IC packaging testing, wafer testing, and chip finished product testing [1] - The company has over 130 types of packaging and testing products, including SOP, QFN/DFN, SOT, TO, LQFP, LGA, FCLGA, BGA, and FCBGA [1] - Huayu Electronics has established long-term partnerships with well-known companies such as BYD, Zhongke Lanyun, and others in the industry [1] Group 2: Financial Performance - The company reported revenues of 558 million yuan, 578 million yuan, and 683 million yuan for the years 2022, 2023, and 2024, respectively [2] - Net profits attributable to the parent company were 85.96 million yuan, 42.02 million yuan, and 56.67 million yuan for the same years [2] Group 3: IPO Fundraising and Projects - The IPO aims to raise 400 million yuan for projects including digital transformation of large-capacity memory and RF module packaging, and the establishment of a testing industrial base in Hefei [2] - The digital transformation project has a total investment of 150 million yuan, expected to add packaging testing capacity of 858 million units per year [2] - The Hefei testing project, with a total investment of 350 million yuan, aims to add wafer testing capacity of 912,000 pieces per year and finished chip testing capacity of 2.4 billion units per year [3] Group 4: Project Returns - The digital transformation project is expected to achieve an average annual revenue of 129.02 million yuan after full production, with a post-tax internal rate of return of 12.30% and a payback period of 7.32 years [3] - The Hefei testing project is projected to generate an average annual revenue of 129.93 million yuan after full production, with a post-tax internal rate of return of 14.80% and a payback period of 6.72 years [3]
华宇电子重启A股IPO 拟募资4亿元加码封测及晶圆测试等项目
Zheng Quan Shi Bao Wang·2025-07-03 07:57