Zhong Guo Jing Ji Wang·2025-07-13 08:29Core Viewpoint - The company Shenzhen Zhongke Feice Technology Co., Ltd. plans to raise up to RMB 250 million through a private placement of shares to specific investors, with the funds allocated for high-end semiconductor quality control equipment projects, headquarters upgrades, and working capital [1][4]. Group 1: Fundraising Details - The total amount to be raised is RMB 250 million, which will be net of issuance costs [1]. - The issuance will be directed towards three main projects: - Shanghai high-end semiconductor quality control equipment R&D and industrialization project with an investment of RMB 734 million [2]. - Shanghai high-end semiconductor quality control equipment R&D testing center project with an investment of RMB 446 million [3]. - Headquarters and R&D center upgrade project with an investment of RMB 620 million [3]. - Additional working capital of RMB 700 million [3]. Group 2: Issuance Structure - The issuance will target no more than 35 specific investors, including various financial institutions and qualified investors [4]. - The pricing for the shares will be set at no less than 80% of the average trading price over the 20 trading days prior to the pricing date [4]. - The total number of shares to be issued will not exceed 96 million, representing 30% of the company's total share capital prior to the issuance [4][5]. Group 3: Control and Management - The actual controllers of the company, Chen Lu and Ha Chengshu, hold a combined 22.91% of the shares, and their control will not change post-issuance [5]. - The company’s main underwriter for this issuance is Guotai Junan Securities Co., Ltd. [6].