中国科技创新债券已发行约6000亿元

Core Insights - The establishment of the bond market technology board has led to the issuance of approximately 600 billion RMB in technology innovation bonds by 288 entities since its launch in May [1][2] - The initiative aims to support three types of institutions: financial institutions, technology enterprises, and equity investment institutions [1] - A risk-sharing tool has been created by the central bank to support equity investment institutions in issuing bonds, providing low-cost refinancing and credit enhancement [1][2] Summary by Categories - Bond Issuance: As of June 30, 27 equity investment institutions in the interbank market issued technology innovation bonds totaling 15.35 billion RMB, with five private equity institutions benefiting from the risk-sharing tool [2] - Policy Effects: The initiative has resulted in longer bond maturities, lower issuance costs, and effective promotion of innovative capital formation [2] - Future Plans: The central bank will continue to utilize the risk-sharing tool in collaboration with relevant departments to foster the development of the technology innovation bond market and enhance financial support for high-level technological self-reliance [2]