Core Viewpoint - The demand for high-end electronic circuit copper foil is surging due to the explosion of artificial intelligence server needs and accelerated 5G base station construction, presenting a historic opportunity for domestic substitution in this sector [1][2]. Group 1: Company Overview - Defu Technology is breaking the long-standing monopoly of foreign companies in the high-end copper foil market, establishing itself as a technological benchmark and market leader in China [1]. - The company has formed stable partnerships with leading global manufacturers such as Shengyi Technology and Taisuo Electronics, with its products covering AI servers, 5G base stations, and consumer electronics [2]. Group 2: Technological Advancements - Defu Technology has invested 183 million yuan in R&D for 2024, marking a 30.45% increase year-on-year, and has added 17 new invention patents, focusing on cutting-edge fields like AI servers, 6G communication, and automotive radar [1]. - The company has successfully developed two major product series, RTF and HVLP copper foil, with HVLP achieving a roughness of less than 1.0μm and a 30% reduction in signal loss compared to traditional products [1]. Group 3: Market Position and Strategy - In 2024, the domestic sales volume of electrolytic copper foil is expected to reach 1.09 million tons, with Defu Technology's high-end electronic circuit copper foil shipment ratio increasing to 10.86% [2]. - The company is focusing on a technology strategy of "high frequency, high speed, and ultra-thin," with plans to develop ultra-low profile copper foil for 6G terahertz communication and materials for solid-state batteries [2].
德福科技突破高端铜箔技术壁垒，加速电子电路材料国产化进程