铜冠铜箔：HVLP铜箔已进入多家头部CCL厂商供应链 订单饱满

Core Viewpoint - The company, Tongguan Copper Foil (301217), has announced the successful integration of its HVLP copper foil into the supply chains of several leading CCL manufacturers, indicating strong demand and a full order book for this specialized material [1] Group 1: Product Overview - HVLP copper foil, or ultra-low profile copper foil, features extremely low surface roughness, excellent signal transmission performance, low loss characteristics, and high stability [1] - This product is specifically designed for ultra-low loss high-frequency and high-speed circuit boards, making it suitable for widespread applications in 5G communication and AI fields [1] Group 2: Production Capacity - The company possesses production capabilities for 1st to 4th generation HVLP copper foil, with current shipments primarily focused on the 2nd generation product [1]