Pacific Sun Packaging, a Subsidiary of PMGC Holdings, Announces Attendance at 2025 ITAD Summit to Showcase Custom Protective Packaging for Enterprise IT Hardware

Core Insights - Pacific Sun Packaging Inc., a subsidiary of PMGC Holdings Inc., is participating in the 2025 ITAD Summit in Las Vegas, marking its first appearance at the event [1] - The company specializes in high-precision, component-specific packaging solutions for IT and electronics hardware, catering to OEMs, data centers, and ITAD firms [1][4] - The CEO emphasized the importance of technical and critical packaging needs in the evolving ITAD and data center industries [2] Company Overview - Founded in 2011, Pacific Sun Packaging focuses on custom-engineered solutions to protect delicate IT components such as CPUs, DIMMs, SSDs, HDDs, and fiber-optic modules [1][4] - The company's packaging solutions are designed to meet rigorous standards for ESD safety, dimensional precision, and supply chain durability [1] - Pacific Sun Packaging is headquartered in San Clemente, California, and is known for its fast design cycles and scalable production capabilities [2][4] Industry Context - The ITAD and data center industries are experiencing evolving packaging needs that are becoming more technical and critical [2] - The summit provides an opportunity for the company to reconnect with existing customers and build relationships with new partners in IT lifecycle management [2] - The company's tailored packaging strategies aim to enhance resale value, reduce returns, and streamline integration [2]