推动科技与产业创新融合 集成电路关键材料制造商恒坤新材即将上会

Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. is set to undergo a review on July 25, showcasing its "hard technology strength" in the semiconductor materials sector [1] Group 1: Business Focus - The company focuses on key materials for integrated circuits, essential for technology upgrades and industry development [2] - Hengkang New Materials is dedicated to the R&D and industrial application of critical materials for the integrated circuit field, serving 12-inch wafer manufacturing [2] - Main products include SOC, BARC, KrF, i-Line, and ArF photoresists, as well as TEOS (purity 9N), primarily used in advanced NAND, DRAM storage chips, and logic chips below the 90nm technology node [2] Group 2: Market Position - In 2024, the company's revenue is projected to approach 540 million yuan, with a year-on-year growth exceeding 49% [3] - SOC revenue is expected to exceed 230 million yuan, and BARC revenue over 45 million yuan, together accounting for more than 50% of total revenue [3] - The domestic market size for SOC is approximately 1.7 billion yuan, and for BARC, about 3.7 billion yuan, indicating a strong market position among domestic manufacturers [3] Group 3: R&D Capabilities - The company has invested over 180 million yuan in R&D over the past three years, with a compound annual growth rate of 43.98% [4] - Hengkang New Materials has developed over 100 products in research, verification, and supply stages, demonstrating its commitment to meeting the needs of wafer manufacturers [4] - The company has been recognized as a "single champion enterprise" in manufacturing and a "national specialized and innovative 'little giant'" enterprise, highlighting its core competitiveness in advanced manufacturing [4] Group 4: Industry Context - The current capital market is increasingly focusing on technology innovation, with Hengkang New Materials' review reflecting the Sci-Tech Innovation Board's support for technological advancements [5] - The Sci-Tech Innovation Board serves as a new support point for "hard technology" enterprises, enabling breakthroughs in key core technologies within new industries and business models [5]