Xin Lang Cai Jing·2025-07-23 23:24Group 1 - The Chinese semiconductor industry is facing significant challenges due to U.S. sanctions, particularly the inability to obtain EUV equipment, leading to reliance on DUV technology for process improvements [1][3] - Recent reports indicate that domestic 5nm chips have achieved mass production with yield rates improving from 35% to 60%-70%, nearing TSMC's initial SF3 yield levels [1][3] - There are doubts regarding the feasibility of achieving high yields with 5nm technology using DUV equipment, with estimates suggesting a 50% increase in costs [1][3] Group 2 - Engineers have utilized quadruple patterning technology (SAQP) to enhance the resolution of DUV equipment, allowing for more precise chip designs despite inherent limitations [3] - Currently, there are no commercially available products utilizing the 5nm process, with the latest Kirin X90 chip still based on 7nm technology [3] - If the rumors about the 5nm process are confirmed, it would represent a significant positive development for all domestic chip manufacturers [3] Group 3 - The global semiconductor industry is closely monitoring China's technological advancements, with reports suggesting that China is testing its own EUV equipment, potentially starting production in the third quarter of this year [3][4] - Successful domestic production of EUV equipment would signify a breakthrough in China's semiconductor industry, enabling further advancements in process technology and challenging major players like Intel, Samsung, and TSMC [4]