ACM Research Announces Major Upgrades to Its Ultra C wb Wet Bench Cleaning Tool for Advanced Chip Manufacturing

Core Insights - ACM Research, Inc. has announced significant upgrades to its Ultra C wb cleaning tool, incorporating a patent-pending nitrogen bubbling technique to enhance wet etching uniformity and cleaning performance [1][2]. Group 1: Technology Enhancements - The upgraded Ultra C wb tool features nitrogen (N2) bubbling technology that addresses issues of poor wet etching uniformity and by-product regrowth commonly found in conventional wet bench processes [2]. - The N2 bubbling technique improves the transport efficiency of phosphoric acid and promotes uniformity in temperature, concentration, and flow velocity within the wet etching bath [2]. - This technology is particularly applicable in the manufacturing processes for 3D DRAM, 3D logic, and 500+ layer 3D NAND devices [2]. Group 2: Performance Improvements - The Ultra C wb platform enhances within-wafer and wafer-to-wafer wet etching uniformity by more than 50% compared to conventional batch processes [6]. - The advanced cleaning capabilities of the Ultra C wb platform have demonstrated effective removal of organic residues from special phosphoric acid additives in advanced-node processes [6]. - The upgraded tool is qualified for three layers of advanced-node processes, including stack silicon nitride removal and channel hole polysilicon etch back [6]. Group 3: Proprietary Technology - The nitrogen bubbling technology generates large-size bubbles with good uniformity, with bubble density being precisely controllable [6]. - The N2 bubbling core technology can also be applied to ACM's Ultra C Tahoe platform, addressing future process requirements for customers [6]. Group 4: Market Position - ACM Research, Inc. is a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, committed to delivering high-performance, cost-effective process solutions [1][7].