Core Viewpoint - The company has approved an investment plan for the construction of a high-end printed circuit board (PCB) project, with an estimated investment amount not exceeding $1 billion, to meet the growing demand in emerging markets such as high-performance servers and artificial intelligence [7][10]. Group 1: Investment Overview - The investment aims to enhance the company's core competitiveness and respond to the increasing market demand for high-density interconnect and high-speed signal transmission PCBs [7][10]. - The project will be funded through the company's own or self-raised funds, and it is necessary to submit the matter for shareholder meeting approval [8][10]. Group 2: Project Details - The project will be implemented by the company's wholly-owned subsidiary, Hong Kong Chao Yi Group, which specializes in advanced PCB manufacturing [9]. - The project is expected to address the limitations of existing production capacity and align with the company's strategic direction towards high-end manufacturing [10][12]. Group 3: Project Necessity and Feasibility - The project is essential due to the rapid growth of applications in high-performance servers and AI, which require advanced PCB products [10][11]. - The company possesses the technical expertise and customer demand to support the project's feasibility, ensuring potential market backing for the production capacity post-implementation [11]. Group 4: Impact on the Company - This investment aligns with national high-end manufacturing policies and aims to enhance the company's high-end PCB production capacity, thereby expanding its operational scale and improving overall economic efficiency [12].
苏州东山精密制造股份有限公司第六届董事会第二十四次会议决议公告