Xin Lang Cai Jing·2025-07-26 11:36Core Insights - The global demand for AI computing power is experiencing unprecedented explosive growth, while the process of domestic substitution is accelerating [1] - The A-share market is witnessing significant development in three major technology sectors: computing power, CPO (Co-Packaged Optics), and PCB (Printed Circuit Board) [1] Group 1: Computing Power Infrastructure - Gansu Qingyang has successfully deployed a domestic 100,000-card intelligent computing cluster, utilizing a fully autonomous architecture and Ascend chips, marking a significant advancement in China's computing power infrastructure [1] - This achievement breaks international technological barriers and signifies a leap from "usable" to "optimal" computing power infrastructure [1] Group 2: CPO Technology - CPO technology integrates optical modules with chip packaging, significantly reducing signal transmission losses and greatly enhancing the energy efficiency and bandwidth of data centers and AI servers [1] - Morgan Stanley predicts that the CPO market will surge from $8 million in 2023 to $9.3 billion by 2030, with a staggering compound annual growth rate (CAGR) of 172% [3] Group 3: PCB Market - The PCB sector is also showing strong growth, driven by the rapid increase in AI inference demand, with applications in servers, switches, and optical modules [3] - Prismark forecasts that the AI server PCB market will achieve a CAGR of 32.5% from 2023 to 2028 [3] Group 4: Investment Opportunities - ZTE Corporation is actively pursuing a "computing power network" strategy, providing comprehensive ICT infrastructure solutions and has won multiple domestic intelligent computing center projects [4] - ZTE has collaborated with NVIDIA to develop a 51.2T CPO switch, setting a new industry record for single-chip bandwidth, which is already applied in Meta's data center [4] - Huada Technology, a leading AI server PCB supplier, has orders booked until 2026 and has made significant breakthroughs in 800G optical module PCB signal integrity [4] - Shengyi Technology, the second-largest copper-clad laminate manufacturer globally, holds over 20% market share in the high-frequency and high-speed CCL market and has achieved a 99.5% yield rate for 800G optical modules [5] - The company has also developed high thermal conductivity PCBs for liquid-cooled servers, successfully applied in the 100,000-card intelligent computing cluster in Qingyang [5] - The top potential stock, H3C, leads the domestic switch market and ranks among the top three globally in AI server shipments, having launched the 51.2T 800G CPO silicon optical switch [4][5]