【WAIC2025】 AI算力创新竞速，国产化实践走出超节点等新路

Core Insights - The 2025 World Artificial Intelligence Conference (WAIC 2025) was held in Shanghai, showcasing innovations in AI chips, servers, and intelligent computing centers, emphasizing domestic R&D and solutions for various application scenarios [1][2]. AI Chip Innovations - Companies like Muxi and Houmo Intelligent presented their self-developed AI chips, with Muxi showcasing the Xiyun C600 general-purpose GPU, designed for cloud AI training and inference [3][4]. - Houmo Intelligent introduced the M50 chip, claiming a 5-10 times efficiency improvement over traditional architectures, with a processing power of 160 TOPS at only 10W, supporting large models locally [5]. Market Trends - The demand for computing power is growing exponentially alongside model iterations, with a shift towards edge AI chips as models migrate from cloud to edge applications [3][5][6]. - The industry is witnessing a trend towards high-efficiency inference becoming mainstream, with inference computing power expected to be 100 to 1000 times that of training power [6]. Supernode Developments - Major Chinese companies like Huawei and Xinhua San showcased their supernode solutions, with Huawei's Ascend 384 supernode being the largest in the industry, achieving 300 PFLOPs of computing power [7][8]. - The LightSphere X supernode, developed by a consortium including Shanghai Yidian and ZTE, utilizes innovative optical interconnect technology for high bandwidth and low latency [9][10]. Industry Collaboration - The development of supernodes requires cross-industry collaboration, as no single chip company can achieve the necessary technological advancements alone [8][10]. - The industry is encouraged to adopt open-source development to accelerate product development and market entry, with a focus on collaborative efforts in computing infrastructure and services [10][12].