艾为电子：拟发行可转债募资不超过19.01亿元 用于多个研发及产业化项目

Group 1 - The company plans to issue convertible bonds to raise no more than 1.901 billion yuan for various R&D and industrialization projects [1] - The funds will be allocated to the construction of a global R&D center, AI and supporting chip R&D and industrialization, automotive chip R&D and industrialization, and motion control chip R&D and industrialization projects [1] - The total investment for the global R&D center construction project is 1.485 billion yuan, with 1.224 billion yuan expected to be funded from the raised capital [1]