Shijia Photons(SH:688313) Zheng Quan Shi Bao Wang·2025-07-29 11:29Core Viewpoint - The company, Shijia Photon, reported significant growth in revenue and net profit for the first half of 2025, driven by advancements in artificial intelligence and a booming data communication market [1][2]. Financial Performance - The company achieved operating revenue of 993 million yuan, a year-on-year increase of 121.12% [1]. - Net profit attributable to shareholders reached 217 million yuan, reflecting a staggering year-on-year growth of 1712.00% [1]. - The net profit excluding non-recurring gains and losses was 214 million yuan, up 12667.42% year-on-year [1]. - The net cash flow from operating activities was 11.16 million yuan, an increase of 158.09% compared to the previous year [1]. Business Segments - The main business segments include PLC optical splitter chips, AWG chips and components, VOA chips and device modules, and various laser chips and devices [2]. - In the first half of 2025, the main business revenue was 976 million yuan, accounting for 98.28% of total revenue, while other business revenue was 17.03 million yuan, making up 1.72% [2]. - Revenue from optical chips and devices reached 700 million yuan, a year-on-year increase of 190.92% [2]. - Revenue from indoor optical cables was 150 million yuan, up 52.93% year-on-year [2]. - Revenue from cable polymer materials was 126 million yuan, reflecting a year-on-year growth of 23.39% [2]. - The company's overseas revenue was 452 million yuan, a remarkable increase of 323.59%, constituting 45.50% of total revenue [2]. Research and Development - The proportion of R&D investment to operating revenue decreased by 5.81 percentage points compared to the previous year, attributed to the faster growth of revenue compared to R&D investment [3]. - R&D investment amounted to 61.42 million yuan, representing a 14.01% increase year-on-year [3]. - The company maintains strategic R&D investments in optical chips and devices, establishing a complete IDM business system covering chip design, wafer manufacturing, processing, and packaging testing [3].