道氏技术：与能斯达及芯培森签署战略合作协议 将碳材料应用于人形机器人电子肌肉等关键零部件材料配方中

Core Viewpoint - The announcement highlights a strategic cooperation agreement between the company, Suzhou Nengsida Electronics Technology, and its affiliate Guangdong Chipenson Technology, focusing on the development and market expansion of key components for humanoid robots, including electronic muscles, electronic skin, and joints [1] Group 1 - The agreement aims to integrate the strengths of the three parties in the research and development of materials required for key components of humanoid robots [1] - The collaboration will involve the application of carbon materials in the formulation of electronic muscles, electronic skin, and joints, enhancing product performance [1] - The agreement is a framework agreement, with specific cooperation matters to be approved and disclosed according to relevant regulations [1]