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道氏技术(300409.SZ)拟与能斯达、芯培森就碳材料应用于人形机器人关键零部件开展合作
智通财经网·2025-07-29 11:38

Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance the development and market expansion of key materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration focuses on integrating the strengths of each party in the development of materials needed for humanoid robot components such as electronic muscles, electronic skin, and joints [1] - The partnership aims to leverage the company's technological and production advantages in carbon materials, while Nengsida has launched several electronic skins for humanoid robots [1] - Chipenson's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the joint efforts in material development [1] Group 2: Product Application and Market Expansion - The strategic cooperation will help the company expand the application scenarios of its carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The initiative is expected to accelerate the application process of carbon materials in key components of humanoid robots, enhancing product performance [1]