晶合集成筹划赴港IPO 深化国际化战略布局

Group 1 - A semiconductor company, Jinghe Integrated, is planning to issue H-shares and list on the Hong Kong Stock Exchange to enhance its international strategy and competitiveness [1] - Other semiconductor companies, such as Chipsea Technology and Weir Shares, have also announced plans for Hong Kong IPOs this year [1] - Jinghe Integrated is in discussions with intermediaries regarding the specifics of the H-share listing, which will not change the control of the company [1] Group 2 - Just days before the IPO announcement, Jinghe Integrated secured a strategic investment from Huaqin Technology, acquiring 6% of its shares for a total of 2.39 billion yuan at 19.88 yuan per share [2] - This marks Huaqin Technology's first venture into the semiconductor wafer manufacturing sector, enhancing its strategic collaboration with Jinghe Integrated [2] - The investment includes a commitment from Huaqin Technology to nominate a director and a 36-month lock-up period for the shares [2] Group 3 - Jinghe Integrated is a leading semiconductor wafer manufacturer, producing various chips used in consumer electronics and industrial applications [3] - The company expects its revenue for the first half of 2025 to be between 5.07 billion and 5.32 billion yuan, representing a year-on-year growth of 15.29% to 20.97% [3] - The projected net profit for the same period is estimated to be between 260 million and 390 million yuan, with a year-on-year increase of 39.04% to 108.55% [3] Group 4 - The increase in revenue is attributed to rising industry demand, higher sales volume, and maintained high capacity utilization [4] - The company has focused on expanding its application areas and developing advanced products, with significant growth in its CIS product line [4] - Research and development investment has increased by approximately 15% compared to the previous year, ensuring continuous innovation and competitive advantage [4]