工信部等七部门：打造高性能产品，加快植入式设备研发突破

Core Viewpoint - The document outlines the implementation opinions from seven departments, including the Ministry of Industry and Information Technology, aimed at promoting innovation and development in the brain-computer interface (BCI) industry, focusing on high-performance products and breakthroughs in implantable devices [1] Group 1: Product Development - The initiative emphasizes the development of high-density neural recording sensors and ultra-low power implantable chips to innovate brain intention recognition functions, enhancing control precision and response speed [1] - It aims to improve existing products such as unidirectional and bidirectional deep brain stimulators, reactive electrical stimulators, and cochlear implants, focusing on enhancing signal acquisition accuracy and functional regulation [1] - The plan encourages the mass production and iteration of non-implantable devices, promoting lightweight, high-speed, and low-power developments in products like adhesive patches, ear patches, in-ear devices, and hairpin-style interfaces [1] Group 2: Integrated Products and Applications - The development of integrated BCI products such as helmets, headsets, glasses, and headphones is highlighted, aiming to merge these with existing consumer products to support iterative applications and large-scale promotion of non-implantable products [1] - The initiative includes the development of auxiliary devices that integrate physiological signal equipment, enhancing interaction control and perceptual assessment accuracy through the fusion of brain signals with electromyography, electrooculography, electrocardiography, and near-infrared signals [1] Group 3: Surgical Technology - The document mentions the research and development of high-precision surgical robots for implantable BCIs, focusing on breakthroughs in sub-micron precision control and dynamic adjustment technology to enhance regional real-time imaging and three-dimensional reconstruction capabilities [1]