Huan Qiu Wang Zi Xun·2025-08-08 04:18Group 1 - Tesla is considering a comprehensive adjustment to the supply chain for its third-generation self-developed AI ASIC chip, Dojo 3 [1] - The advanced front-end manufacturing process for Dojo 3 may be handled by Samsung's foundry, while the advanced back-end packaging is planned to be managed by Intel [1] - The Dojo 1 chip utilizes 7nm advanced process and InFO-SoW large-area advanced packaging technology, entirely produced by TSMC [2] Group 2 - The second-generation product, Dojo 2, is expected to achieve mass production by TSMC within the year [2] - Elon Musk previously indicated plans to unify AI6 and Dojo 3 into a single architecture, eliminating the development of a standalone Dojo 3 and instead reusing the ASIC Die of AI6 for larger scale [2] - Samsung's Taylor semiconductor plant in the U.S. is expected to provide 2nm process foundry support for the AI6 chip and is also anticipated to support Dojo 3 [2]