券商“抢滩”发行科创债

Group 1 - On June 18, Guotai Junan Securities announced that it received approval from the China Securities Regulatory Commission (CSRC) to publicly issue technology innovation corporate bonds with a total face value of no more than 15 billion yuan [1] - Since June, five securities firms, including CITIC Securities and Guotai Junan Securities, have received approval from the central bank and CSRC to issue technology innovation bonds, with a total approved amount not exceeding 93.8 billion yuan [1][2] - The approved amounts for the securities firms include 15 billion yuan for CITIC Securities, 9.8 billion yuan for CICC, 15 billion yuan for Guotai Junan Securities, 6 billion yuan for CITIC Jianzhong, and 10 billion yuan for Huatai Securities [1] Group 2 - The issuance of technology innovation bonds in the interbank market by securities firms represents a significant expansion of their direct financing channels, allowing them to choose the most suitable market for financing based on their characteristics and needs [2] - Following the announcement by the central bank and CSRC on May 7 to support the issuance of technology innovation bonds, securities firms have actively sought to issue these bonds [2] - As of June 18, 29 securities firms have issued 33 technology innovation bonds, with a total issuance scale of 28.47 billion yuan, indicating strong interest from institutional investors [3] Group 3 - The funds raised from the issuance of technology innovation bonds are primarily used to support businesses in the technology innovation sector, including investments in technology innovation stocks, bonds, ETFs, and industry funds [3][4] - For example, CITIC Securities plans to allocate no less than 50% of the funds for investments that meet capital market requirements and at least 20% for providing market-making and risk hedging services for technology innovation board stocks and funds [4] - The expansion of the bond issuance scope allows securities firms to provide comprehensive services to technology innovation enterprises, enhancing their role as both issuers and underwriters of technology innovation bonds [4]