Mei Ri Jing Ji Xin Wen·2025-08-12 00:17Core Viewpoint - The demand for overseas computing power is driving an increase in both volume and price of PCBs, leading to rapid market expansion, with projections indicating that the AI PCB market could reach $5.6 billion in 2025 and $10 billion in 2026 [1] Group 1: Market Dynamics - The domestic PCB manufacturers are accelerating capacity expansion, but the release efficiency of high-end capacity is expected to lag behind the growth rate of demand, resulting in a persistent supply-demand gap [1] - New process iterations and upgrades are anticipated to create new market demand increments [1] Group 2: Technological Advancements - As AI computing hardware evolves towards high density and high bandwidth, reducing dielectric constant (dk) and dielectric loss (df) is crucial for overcoming transmission bottlenecks [1] - Future AI developments are expected to continuously iterate PCB process technology paths, which will be reflected in structural integration (such as CoWoP and substrate integration), functional upgrades (like orthogonal backplane replacing copper connections), and material breakthroughs (including M9, PTFE, and quartz cloth) [1]