CoWoP下一代芯片封装技术，PCB制造、材料供应及设备环节有望受益

Core Viewpoints - The AI boom is emerging, and CoWoP is expected to become the next-generation chip packaging technology, benefiting PCB manufacturing, material supply, and equipment sectors [3][6]. Market Review - In the past week (August 4-8), the SW Electronics Index rose by 1.65%, outperforming the CSI 300 Index by 0.42 percentage points. The performance of the six sub-sectors is as follows: Consumer Electronics (4.27%), Other Electronics II (4.06%), Electronic Chemicals II (2.70%), Optical Electronics (1.51%), Semiconductors (1.45%), and Components (-1.59%) [2]. CoWoS and CoWoP Technology - CoWoS, led by TSMC, is a 2.5D advanced packaging technology that overcomes traditional packaging limitations in bandwidth and energy efficiency. CoWoS types include CoWo-S, CoWoS-L, and CoWo-R, with CoWo-S being the most mature and suitable for current AI chip demands [4]. - CoWoP technology evolves from CoWoS, focusing on eliminating the ABF packaging substrate and directly bonding the silicon interposer to high-density PCBs [5][6]. CoWoP Advantages and Beneficiaries - CoWoP offers advantages such as reduced loss, improved NVLink coverage and stability, optimized power efficiency, and enhanced heat dissipation [6]. - Beneficiaries of the CoWoP supply chain include PCB manufacturers like Shenghong Technology, Shenzhen South Circuit, and Pengding Holdings, as well as material suppliers such as Honghe Technology and Fangbang Co., Ltd. [7]. Investment Recommendations - The electronic industry maintains an "overweight" rating, with expectations of a comprehensive recovery in the semiconductor sector by 2025. Companies with real performance and low PE/PEG ratios in semiconductor design, key materials, and the silicon carbide industry are recommended for attention [8].