开源证券：高端先进封装进入高速发展期 重视自主可控趋势下投资机会

Core Viewpoint - The advanced packaging industry is expected to enter a rapid development phase by 2025, with domestic packaging manufacturers likely to benefit from key breakthroughs in high-end advanced packaging technology [1] Group 1: Industry Development - Advanced packaging is a crucial path to enhance chip performance beyond Moore's Law, with significant upgrades in packaging processes leading to various advanced packaging types such as FC, FO, WLCSP, SiP, and 2.5D/3D [1] - The global advanced packaging market is projected to grow from $37.8 billion in 2023 to $69.5 billion by 2029, driven by strong demand in high-performance computing (HPC), AI/machine learning, data centers, and high-end consumer electronics [2] Group 2: Supply Side Dynamics - The growth in advanced packaging wafer numbers is primarily driven by 2.5D/3D packaging, with a CAGR of 30.5% from 2023 to 2029, supporting sectors like AI/ML, HPC, data centers, CIS, and 3DNAND [3] - TSMC is significantly expanding its CoWoS capacity, expecting to reach 90,000 to 110,000 wafers per month by 2026 due to high demand [3] - Domestic manufacturers are gaining advanced packaging industrialization capabilities, with leading firms capturing a significant share in the mid-to-high-end advanced packaging market [3]