深南电路：FC-BGA封装基板现已具备20层及以下产品批量生产能力

Group 1 - The company Shennan Circuit (002916.SZ) has announced that it has achieved mass production capability for FC-BGA packaging substrates with 20 layers and below, while the technical research and sample production for products with more than 20 layers is progressing on schedule [1] - The production capacity of the Guangzhou packaging substrate project is rapidly increasing, and the ramp-up of capacity is steadily advancing [1] - Key material characteristics such as Coefficient of Thermal Expansion (CTE) and loss factor (Df) vary among different materials [1] Group 2 - Investors have inquired about several aspects of the FC-BGA products, including yield rates, maximum substrate size, CTE, dielectric loss (Df), and current monthly production capacity [3]