UNICOMP(SH:688531) Jin Rong Jie·2025-08-16 01:05Group 1 - The core viewpoint of the news is that Riken Technology Group Co., Ltd. has obtained a patent for a "magazine-type semiconductor wafer unloading mechanism," which aims to improve the efficiency of semiconductor wafer unloading processes [1] Group 2 - The patent, authorized under announcement number CN223225227U, was applied for on August 2024 and is categorized under semiconductor production technology [1] - The mechanism includes components for warehouse positioning, clamping, and transfer, designed to facilitate the orderly unloading of semiconductor wafers [1] - The structure of the unloading mechanism is compact, space-efficient, and easy to maintain, which effectively enhances the unloading efficiency of semiconductor wafers [1] Group 3 - Riken Technology Group Co., Ltd. was established in 2009 and is located in Wuxi City, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 114.504414 million RMB and has made investments in 9 enterprises [2] - Riken Technology has participated in 83 bidding projects and holds 411 patents, along with 14 trademark registrations and 28 administrative licenses [2]