补北京芯片链条短板！IC PARK新增三个共性技术服务平台

Core Insights - The launch of three service platforms at the IC PARK aims to address common technology challenges in the chip industry, enhancing Beijing's integrated circuit testing capabilities [1][3][5] Group 1: Service Platforms - The newly established High-Speed Signal Testing Laboratory will provide systematic testing services for high-speed signals, RF consistency, satellite communication, and transient thermal testing [1][3] - The Advanced Packaging Technology Service Joint Center will support enterprises in advanced packaging, contributing to a more resilient and competitive integrated circuit industry chain in Beijing [1][5] - The Power Cycling and Transient Thermal Testing Laboratory offers services such as thermal testing, thermal simulation, thermal analysis, and reliability testing, utilizing domestically developed equipment that matches international standards [5] Group 2: Industry Impact - The High-Speed Signal Testing Laboratory significantly improves the R&D efficiency of chip design companies in Beijing, reducing the time and costs associated with sending chips for testing to southern regions [3][5] - The establishment of these testing facilities is expected to lower R&D costs for domestic enterprises by saving time in the development process [3][5] - The C20 Semiconductor Seed Enterprise Growth Camp aims to provide tailored support for participating companies, fostering collaboration and growth among 80 "seed" enterprises [5]