机构预测AI驱动先进封装市场规模将扩大至695亿美元，科创半导体ETF（588170）午盘急速拉升，涨超2%

Group 1 - The core viewpoint highlights a strong performance in the semiconductor sector, with the STAR Market Semiconductor Materials and Equipment Index rising by 2.54% as of August 20, driven by significant gains in constituent stocks such as Xinyi Chang and Zhongke Feimeng [1] - The STAR Semiconductor ETF (588170) has shown a cumulative increase of 3.18% over the past week, with a recent price of 1.13 yuan, indicating a positive trend in investor sentiment [1] - The liquidity of the STAR Semiconductor ETF is robust, with a turnover rate of 29.2% and a trading volume of 135 million yuan, reflecting active market participation [1] Group 2 - Yole forecasts that the global advanced packaging market will grow from $37.8 billion in 2023 to $69.5 billion by 2029, driven primarily by demand in telecommunications and infrastructure, including AI and high-performance computing [2] - Open Source Securities emphasizes the advantages of diverse advanced packaging technologies, which can deliver high performance, low cost, compact size, and shorter cycles, presenting investment opportunities in domestic packaging manufacturers [2] - The STAR Semiconductor ETF (588170) and its linked funds focus on semiconductor equipment (59%) and materials (25%), highlighting the importance of domestic substitution in the semiconductor industry [2][3]