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艾为电子:布局端侧AI芯片 加快高性能数模混合等新料号推出

Core Viewpoint - The company aims to accelerate the launch of new high-performance analog-digital mixed, power management, and signal chain chips in the second half of the year, focusing on edge AI applications and leveraging specialized hardware accelerators and multi-core collaboration technologies [1][3]. Financial Performance - In the first half of the year, the company achieved total revenue of 1.37 billion yuan, a year-on-year decrease of 13.4%, while net profit attributable to shareholders was 157 million yuan, a year-on-year increase of approximately 70%, with basic earnings per share of 0.67 yuan [1]. - The decline in revenue was attributed to a mismatch in demand from downstream consumer electronics clients compared to the previous year, but the company mitigated this impact by strengthening its presence in high-value sectors like industrial interconnect and automotive chips [1]. Product Development - The company launched approximately 150 new product models in the first half of the year, covering various sectors including consumer electronics, industrial, and automotive [2]. - High-performance analog-digital mixed chips and power management chips are expected to be the main growth drivers for the second half of the year [3]. - The company has developed ultra-low power high-voltage piezoelectric micro-pump liquid cooling drive products, marking a significant breakthrough in mobile device thermal management systems [3]. Future Plans - The company plans to issue convertible bonds to raise up to 1.901 billion yuan for global R&D center construction, edge AI chip development, automotive chip development, and motion control chip projects [4]. - The issuance of convertible bonds is progressing as planned, with relevant projects having completed necessary filing procedures [4].