Di Yi Cai Jing·2025-08-21 06:52Core Insights - The People's Bank of China Guangdong Branch has implemented various measures to support the issuance of technology innovation bonds by financial institutions, technology enterprises, and equity investment institutions, aiming to facilitate high-quality development in the technology innovation sector [1] Group 1: Bond Market Developments - The "Technology Board" in the bond market has been launched for three months, with a total of 441.05 billion yuan issued by 2 financial institutions, 12 technology enterprises, and 4 equity investment institutions as of August 18, 2025, achieving full coverage of the three categories [1] - The issuance of technology innovation bonds has focused on supporting private enterprises and key sectors, with TCL Technology Group Co., Ltd. issuing two phases of bonds totaling 3 billion yuan and Jinfat Technology Co., Ltd. issuing 1 billion yuan [1] Group 2: Green Technology Support - China Southern Power Grid Co., Ltd. issued two technology innovation bonds totaling 7.5 billion yuan, including one bond with dual attributes of "green + technology innovation," significantly supporting the development of the green technology sector [1]