回天新材：产品尚未应用于液冷服务器中

Core Viewpoint - The company is currently focusing on the development of high thermal conductivity encapsulation glue products specifically for liquid cooling ultra-rapid modules, which have not yet been applied in liquid cooling servers [1] Group 1 - The company is engaged in the layout of high thermal conductivity encapsulation glue products [1] - The current product focus is on liquid cooling ultra-rapid modules [1] - The products have not yet been utilized in liquid cooling servers [1]