颀中科技上半年净利润同比下滑38.78% 研发投入增长35.32%

Core Insights - The company reported a revenue of 996 million yuan for the first half of 2025, representing a year-on-year growth of 6.63%, while the net profit attributable to shareholders decreased by 38.78% to 99.19 million yuan [1] - Despite the global semiconductor market recovery, the company's net profit decline was primarily due to a significant drop in revenue from non-display chip packaging and testing services, which fell by 20.84% to 64.08 million yuan [1] Financial Performance - Revenue for the first half of 2025: 996 million yuan, up 6.63% year-on-year [1] - Net profit for the first half of 2025: 99.19 million yuan, down 38.78% year-on-year [1] - Revenue from non-display chip packaging and testing: 64.08 million yuan, down 20.84% year-on-year [1] Research and Development - R&D investment reached 92.31 million yuan in the first half of 2025, an increase of 35.32% year-on-year [2] - The number of R&D personnel increased to 295, a growth of 19.43%, accounting for 12.87% of the total workforce [1] - The company established a joint training base with Hefei University of Technology to enhance academic research and industry practice [1] Technological Innovation - The company obtained 10 authorized invention patents and 18 utility model patents in the first half of 2025, covering various fields such as chip packaging structure and automated production [2] - The company aims to accelerate the localization of advanced packaging and testing in China's integrated circuit industry, focusing on technology innovation as a core driver [2] Market Strategy - The company is actively expanding its non-display packaging and testing capabilities to meet the growing demand for power chips in high-power sectors such as renewable energy [2] - The company is enhancing its process capabilities in wafer front-side metallization, back thinning and metallization, and copper clip bonding [2]